GAP Pad provides effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps or even rough surfaces are present. By eliminating these gaps the thermal resistance is reduced considerably. GAP - Pad is also highly conformable and therefore reduces thermal resistance and has low-stress vibration dampening.

Advanced Seals & Gaskets Ltd are able to manufacture a wide variety of products from Gap Pad including:

All of the above can be manufactured in either plain or self-adhesive backed, peel-able liner. This specialist material is available in a range of products including soft, ultra soft and ultimate. They are thermally conductive, silicone free, malleable and reinforced.

Key Characteristics of RFI/EMI/EMC Gap-Pad:

  • Highly comformable
  • Low hardness
  • Puncture, shear and tear resistance
  • Low-stress vibration dampening
  • Reduces thermal resistance

Product Enquiry

For information on RFI/EMI/EMC Gap-Pad please complete the following quick enquiry or call us on +44(0)1384 252555.

    Product Specification & Key Characteristics

    • Colour: Anthracite
    • Density: <90KG/M³
    • Fire Propagation Index: <12
    • Operating Temperature: -30°C to 100ºC
    • Thickness: 1mm – 100mm (can be laminated for greater thickness)

    Full technical data can be supplied upon request,
    or downloaded from our online portal.

    What are GAP Pad?

    In the world of electronics and telecommunications, the battle against electromagnetic interference (EMI) is an ongoing challenge. As technology continues to advance, the demand for high-performance electronic devices and systems also rises. In this landscape, EMC (Electromagnetic Compatibility) foil tape emerges as a vital tool for achieving EMI shielding, grounding, and protection. In this article, we will explore what EMC foil tape is, why it is used, its benefits, and the advantages it offers.

    What is EMC Foil Tape?

    EMC foil tape, or Electromagnetic Compatibility foil tape, is a specialized adhesive tape designed to provide effective EMI shielding and grounding in electronic and electrical applications. It is typically constructed with a thin layer of metal foil (commonly aluminum or copper) that is adhered to a flexible backing material, often made of polyester or polypropylene. This construction allows EMC foil tape to offer exceptional electrical conductivity, while remaining flexible and easy to apply.

    Why use GAP Pad?

    EMI Shielding: EMC foil tape serves as an efficient shield against electromagnetic interference (EMI) and radio frequency interference (RFI). It prevents external electromagnetic signals from penetrating electronic components, ensuring they operate without disruption.

    Grounding: By providing a conductive path, EMC foil tape can effectively ground electronic components. This is essential for dissipating static charges, preventing electrostatic discharge (ESD), and ensuring safety in sensitive electronic environments.

    Cable and Connector Shielding: EMC foil tape is used to shield cables and connectors, minimizing signal degradation and ensuring the integrity of data transmission in applications like telecommunications and data centers.

    Circuit Board Repairs: When printed circuit boards (PCBs) or flexible circuits are damaged, EMC foil tape can be used to repair or bridge connections, restoring functionality.

    Versatile Applications: EMC foil tape is adaptable to various applications, including electronics manufacturing, aerospace, automotive, medical devices, and telecommunications.

    Benefits of GAP Pad

    High Electrical Conductivity
    EMC foil tape is designed to offer exceptional electrical conductivity due to its metal foil composition. This ensures efficient grounding and effective EMI shielding.

    Flexibility and Conformability
    The flexible backing material of EMC foil tape allows it to conform to irregular shapes and intricate designs. This flexibility makes it ideal for various electronic components and applications.

    Easy Application
    EMC foil tape comes with an adhesive backing, making it easy to apply and ensuring a secure bond to surfaces. This simplifies installation and repairs.

    Clean and Residue-Free Removal
    When it's time to remove EMC foil tape, it does so cleanly without leaving adhesive residue behind. This feature is especially crucial when maintaining and servicing electronic components.

    Customizable Options
    EMC foil tape is available in various sizes, thicknesses, and configurations, allowing users to select the most suitable tape for their specific requirements.

    Advantages of Using GAP Pad

    Enhanced Component Reliability
    EMC foil tape helps ensure the reliability and longevity of electronic components by protecting them from EMI and RFI, reducing the risk of malfunctions.

    Improved Data Integrity
    In applications where data transmission is critical, such as telecommunications and data centers, EMC foil tape ensures the integrity of data signals by minimizing interference.

    Cost Savings
    By preventing EMI-related issues and minimizing the need for repairs or replacements, EMC foil tape contributes to cost savings in the long run.

    Safety and Compliance
    EMC foil tape plays a crucial role in ensuring safety and compliance with industry standards, particularly in environments where EMI and ESD can pose safety risks.

    Broad Application Range
    EMC foil tape is versatile and adaptable to a wide range of applications, making it a valuable tool in various industries and settings.


    Have a Question about GAP Pad?

    Please contact us using the form below or by calling us on +44(0)1384 252555.