RFI/EMI/EMC Gap-Pad

Advanced Seals & Gaskets Ltd manufacture a diverse range of Gap Pad products. GAP Pad is a range of thermal interface materials used in the electronic industry and has greater conformability, higher thermal performance and easier application.

GAP Pad provides effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps or even rough surfaces are present. By eliminating these gaps the thermal resistance is reduced considerably. GAP - Pad is also highly conformable and therefore reduces thermal resistance and has low-stress vibration dampening.

Advanced Seals & Gaskets Ltd are able to manufacture a wide variety of products from Gap Pad including:

All of the above can be manufactured in either plain or self-adhesive backed, peel-able liner. This specialist material is available in a range of products including soft, ultra soft and ultimate. They are thermally conductive, silicone free, malleable and reinforced.

Key Characteristics of RFI/EMI/EMC Gap-Pad:

  • Highly comformable
  • Low hardness
  • Puncture, shear and tear resistance
  • Low-stress vibration dampening
  • Reduces thermal resistance
Rfi/Emi/Emc Gap-Pad

Help and guidance

If you would like to speak to a representative to discuss your specific application or requirements please call our sales office direct on 01384 469100, alternatively you can send an E-mail. Simply click on the link and forward us your details along with your question and we will contact you immediately.

Quality of our RFI/EMI/EMC Gap-Pad

The quality of service and the products manufactured from RFI/EMI/EMC Gap-Pad is controlled by our Quality Management Systems which is certified to ISO 9001.

Call now for sample requests or further help.

Material Enquiry

For information on RFI/EMI/EMC Gap-Pad please complete the following quick enquiry or call us on +44(0)1384 252555.






    Material Specification

    Full technical data can be supplied upon request,
    or downloaded from our online portal.