T flex is a soft gap filling interface pad composed of a silicone elastomer, boron nitride filler and reinforced with fibreglass. Tflex is naturally tacky and so doesn't require additional adhesives to be applied. Advanced Seals & Gaskets Ltd are able to manufacture a wide variety of products from Tflex including:

Tflex is a cost-effective gap filler thermal interface material with excellent thermal performance, it is used in applications such as cooling components, storage drives, heat pipes, engine control units and telecommunications.

Key Characteristics of RFI/EMI/EMC T Flex:

  • Stable from -45°C to 200°C
  • Meets UL94 V0 rating
  • Naturally tacky on both sides
  • Thermal conductivity - 3 W/mk

Product Enquiry

For information on RFI/EMI/EMC T Flex please complete the following quick enquiry or call us on +44(0)1384 252555.

    Product Specification & Key Characteristics

    • Colour: Anthracite
    • Density: <90KG/M³
    • Fire Propagation Index: <12
    • Operating Temperature: -30°C to 100ºC
    • Thickness: 1mm – 100mm (can be laminated for greater thickness)

    Full technical data can be supplied upon request,
    or downloaded from our online portal.

    What are T flex?

    In the age of ever-advancing technology, the need to manage electromagnetic interference (EMI) has become a critical consideration. EMC T Flex, a specialized solution designed to address electromagnetic interference and ensure optimal thermal management, has emerged as an invaluable tool in various industries. This article delves into what EMC T Flex is, why it is an essential component, the benefits it offers, and the unique advantages it brings to the realm of electronics and beyond.

    What is EMC T Flex?

    EMC T Flex, an abbreviation for Electromagnetic Compatibility (EMC) Thermal Interface Material (TIM), is a specialized material designed to address the challenges posed by electromagnetic interference (EMI) while simultaneously providing effective thermal management. This material, often available in the form of pads or sheets, boasts exceptional thermal conductivity properties. It is used to establish a thermally conductive interface between electronic components and heat sinks.

    The primary functions of EMC T Flex are twofold: it effectively dissipates heat, preventing electronic components from overheating, and shields sensitive electronics from external EMI, ensuring optimal device performance.

    Why use T flex?

    1. Heat Dissipation: EMC T Flex is employed to facilitate efficient heat dissipation in electronic devices. By serving as a thermally conductive interface, it ensures that heat generated by electronic components is efficiently transferred to heat sinks or other cooling mechanisms.
    2. EMI Shielding: In environments where electromagnetic interference can disrupt electronic device performance, EMC T Flex is used to provide EMI shielding. It acts as a barrier, preventing external electromagnetic signals from interfering with sensitive electronic components.
    3. Thermal Management: Effective thermal management is vital in applications with high heat loads. EMC T Flex contributes to maintaining the proper operating temperature of electronic components, preventing overheating and ensuring continuous performance.
    4. Gap Filling: EMC T Flex is used to fill gaps and air pockets between electronic components and heat sinks, ensuring intimate contact, which is essential for efficient thermal performance.

    Benefits of T flex

    Efficient Heat Dissipation
    EMC T Flex excels in efficiently dissipating heat, ensuring that electronic components remain within their safe operating temperature range.

    Reliable EMI Shielding
    EMC T Flex offers reliable EMI shielding, ensuring that electronic devices remain free from external electromagnetic interference, which can disrupt their operation.

    Enhanced Thermal Conductivity
    The material's high thermal conductivity properties ensure efficient heat transfer, maintaining the desired operating temperature for electronic components.

    Gap Filling
    By filling gaps and air pockets, EMC T Flex eliminates thermal resistance, optimizing thermal performance and preventing thermal hotspots.

    EMC T Flex's properties contribute to the longevity and reliability of electronic components, reducing the likelihood of overheating-related failures.

    Advantages of UsingT flex

    Dual Functionality
    EMC T Flex offers both thermal management and EMI shielding capabilities, making it a multifunctional material that simplifies design and assembly.

    Customizable Solutions
    EMC T Flex is available in various formulations, thicknesses, and sizes, allowing for customization to meet specific project requirements.

    Cost Savings
    By preventing overheating-related issues, EMC T Flex helps reduce the need for costly repairs or component replacements, leading to cost savings in the long run.

    Regulatory Compliance
    EMC T Flex aids in compliance with industry standards and regulations concerning EMI/RFI emissions and susceptibility, ensuring the safety and reliability of electronic equipment.

    EMC T Flex is versatile and adaptable to various electronic and thermal management applications, making it a valuable asset in industries where thermal management and EMI protection are essential.

    Have a Question about T flex

    Please contact us using the form below or by calling us on +44(0)1384 252555.