Advanced Seals & Gaskets Ltd manufacture a diverse range of Tgon products.

Advanced Seals & Gaskets Ltd Tgon product is a thermal interface material used where electrical contact and thermal transfer are required. Advanced Seals & Gaskets Ltd are able to manufacture a wide variety of products from Tgon including:

All of the above can be manufactured in either plain or self-adhesive backed, peel-able liner on one or both sides. The grain-oriented, plate-like structure provides high thermal conductivity making it suitable in applications such as power conversion equipment, telecommunications hardware and notebook computers.

Key Characteristics of RFI/EMI/EMC T Gon:

  • High thermal conductivity of 5 W/mK in Z-axis and 240 W/mK in the X-Y axis
  • >98% graphite
  • Low thermal resistance
Material Enquiry

For information on RFI/EMI/EMC T Gon please complete the following quick enquiry or call us on +44(0)1384 252555.

    Material Specification

    Full technical data can be supplied upon request,
    or downloaded from our online portal.



    Advanced Seals & Gaskets are leading manufacturers of Acoustic Foam gaskets, all produced in-house using state of the art machinery and bespoke tooling. 

    We work closely with our customers to provide high quality gaskets to their specifications, drawings or samples and able to keep lead times and costs to a minimum as we do not need to rely on external manufacturers. 

    From a standard rectangular gasket, gasket tape or customised items requiring slots and bolt holes, we can deliver 1 off or 1000’s off product runs, in thicknesses of just 1mm thick up to 100mm thick (without laminations).  

    Acoustic Foam material is flexible, easy to fabricate and pressed into a variety of shapes for ease of application onto curved surfaces.

    Product Enquiry

    For information on RFI/EMI/EMC T Gon please complete the following quick enquiry or call us on +44(0)1384 252555.

      Product Specification & Key Characteristics

      • Colour: Anthracite
      • Density: <90KG/M³
      • Fire Propagation Index: <12
      • Operating Temperature: -30°C to 100ºC
      • Thickness: 1mm – 100mm (can be laminated for greater thickness)

      Full technical data can be supplied upon request,
      or downloaded from our online portal.

      What is EMC T Gon?

      In an increasingly interconnected world where electronic devices are ubiquitous, managing electromagnetic interference (EMI) is paramount. EMC T Gon, a specialized solution designed to tackle electromagnetic interference, is becoming an essential tool in various industries. This article delves into what EMC T Gon is, why it's a vital asset, the benefits it offers, and the distinct advantages it brings to the realm of electronics and beyond.

      What is EMC T Gon?

      EMC T Gon, an abbreviation for Electromagnetic Compatibility (EMC) Thermally Conductive Gap Filler, is a specialized material engineered to address the challenges posed by electromagnetic interference (EMI) while simultaneously providing effective heat dissipation. It typically consists of a thermally conductive gap filler material that exhibits excellent thermal conductivity properties. This material is designed to be placed in the gaps between electronic components and heat sinks to enhance thermal management while ensuring EMI protection.

      The primary function of EMC T Gon is twofold: it dissipates heat efficiently, preventing electronic components from overheating, and shields sensitive electronics from external EMI, ensuring optimal device performance.

      Why Use EMC T Gon?

      Heat Dissipation: EMC T Gon is employed to facilitate effective heat dissipation in electronic devices. By filling gaps between components and heat sinks, it ensures efficient cooling, preventing overheating and potential damage to electronic equipment.

      EMI Shielding: In electronic devices where electromagnetic interference can disrupt performance, EMC T Gon is used to provide EMI shielding. It acts as a barrier, preventing external electromagnetic signals from interfering with sensitive electronic components.

      Gap Filling: EMC T Gon effectively fills gaps and air pockets between electronic components, ensuring intimate contact, which is essential for optimal thermal performance and efficient heat transfer.

      Thermal Management: Effective thermal management is vital in applications with high heat loads. EMC T Gon contributes to maintaining the proper operating temperature of electronic components, preventing thermal throttling, and ensuring continuous performance.

      Benefits of EMC T Gon

      Effective Heat Dissipation
      EMC T Gon excels in dissipating heat efficiently, preventing electronic components from overheating and extending their operational life.

      Improved EMI Shielding
      EMC T Gon offers reliable EMI shielding, ensuring that electronic devices remain free from external electromagnetic interference, which can disrupt their operation.

      Enhanced Thermal Conductivity
      The material's high thermal conductivity properties ensure efficient heat transfer, maintaining the desired operating temperature for electronic components.

      Gap Filling
      By filling gaps and air pockets, EMC T Gon eliminates thermal resistance, optimizing thermal performance and preventing thermal hotspots.

      EMC T Gon's properties contribute to the longevity and reliability of electronic components, reducing the likelihood of overheating-related failures.

      Advantages of Using EMC T Gon

      Dual Functionality
      EMC T Gon offers both thermal management and EMI shielding capabilities, making it a multifunctional material that simplifies design and assembly.

      Tailored Solutions
      EMC T Gon is available in various formulations, thicknesses, and sizes, allowing for customization to meet specific project requirements.

      Cost Savings
      By preventing overheating-related issues, EMC T Gon helps reduce the need for costly repairs or component replacements.

      Regulatory Compliance
      EMC T Gon aids in compliance with industry standards and regulations concerning EMI/RFI emissions and susceptibility, ensuring the safety and reliability of electronic equipment.

      EMC T Gon is versatile and adaptable to various electronic and thermal management applications, making it a valuable asset in industries where EMI protection and efficient thermal management are critical.

      Have a Question about Acoustic Foam Gaskets?

      Please contact us using the form below or by calling us on +44(0)1384 252555.